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Analysis types
  • Linear Stress
  • LabelMover
Keywords :
cracks, bending strength,
stress, smd
Useful informations :
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surface mounted component test geometry

(Description)

Expected results
  • Stress (right image)
  • Cracks consequence (image below)
zoomed mesh

(Mesh zoom - solder)
stress field

(Postprocessor : stress)

Other results
  • Shape improvement according to strain and stress limits
  • Voltage influence on stress and temperature effects.
stress curves

(Curves of different stress definitions - solder)
deformations

(Strain check)

Updated April 2010 | Contact Infos for questions or comments. | Copyright 1997-2012 Ocsimize all rights reserved | Cordes-sur-Ciel France